The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8932913 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 13, 2015

Filed:

Apr. 13, 2012
Applicants:

Shinya Sasagawa, Chigasaki, JP;

Akihiro Ishizuka, Sagamihara, JP;

Inventors:

Shinya Sasagawa, Chigasaki, JP;

Akihiro Ishizuka, Sagamihara, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/84 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4236 (2013.01); H01L 29/785 (2013.01); H01L 29/7869 (2013.01); H01L 29/42384 (2013.01); H01L 29/78603 (2013.01); H01L 29/78696 (2013.01);
Abstract

To provide a semiconductor device which prevents defects and achieves miniaturization. A projecting portion or a trench (a groove portion) is formed in an insulating layer and a channel formation region of a semiconductor layer is provided in contact with the projecting portion or the trench, so that the channel formation region is extended in a direction perpendicular to a substrate. Thus, miniaturization of the transistor can be achieved and an effective channel length can be extended. In addition, before formation of the semiconductor layer, an upper-end corner portion of the projecting portion or the trench with which the semiconductor layer is in contact is subjected to round chamfering, so that a thin semiconductor layer can be formed with good coverage.


Find Patent Forward Citations

Sasagawa, Shinya. (2015). Manufacturing method of semiconductor device (U.S. Patent No. 8932913). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8932913

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