The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Sep. 11, 2013
Ebara Corporation, Tokyo, JP;
Kyushu Institute of Technology, Fukuoka, JP;
Hisanori Matsuo, Tokyo, JP;
Keiichi Kimura, Fukuoka, JP;
Keisuke Suzuki, Fukuoka, JP;
Panart Khajornrungruang, Fukuoka, JP;
Takashi Kushida, Fukuoka, JP;
Ebara Corporation, Tokyo, JP;
Kyushu Institute of Technology, Fukuoka, JP;
Abstract
The present invention relates to a method of measuring surface properties of a polishing pad which measures surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The method of measuring surface properties of a polishing pad includes applying a laser beam to the polishing pad, detecting scattered light that is reflected and scattered by the polishing pad with a photodetector and performing an optical Fourier transform on the detected scattered light to produce an intensity distribution corresponding to a spatial wavelength spectrum based on surface topography of the polishing pad, and calculating a numerical value representing surface properties of the polishing pad based on the intensity distribution corresponding to two different prescribed spatial wavelength ranges.