The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2015

Filed:

Feb. 09, 2012
Applicants:

Akihiko Nakamura, Kanagawa, JP;

Atsushi Miyanari, Kanagawa, JP;

Yoshihiro Inao, Kanagawa, JP;

Inventors:

Akihiko Nakamura, Kanagawa, JP;

Atsushi Miyanari, Kanagawa, JP;

Yoshihiro Inao, Kanagawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/10 (2006.01); B32B 38/18 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
B32B 38/1841 (2013.01); H01L 21/68 (2013.01); H01L 21/68742 (2013.01); B32B 37/0046 (2013.01); B32B 2038/1891 (2013.01); B32B 2309/68 (2013.01); B32B 2457/14 (2013.01);
Abstract

An attaching method for attaching a support plate to a surface of a substrate with an adhesive involves the steps of applying an adhesive to the surface of the substrate, heating and thereafter cooling the substrate, positioning centers of the substrate and the supporting plate to coincide with each other, and forming a layered structure by pushing the supporting plate onto the substrate with the adhesive therebetween in a pressure-reduced atmosphere. In the positioning step, after the supporting late has been placed on the substrate, it is possible to finely adjust the alignment of the supporting plate and a semiconductor wafer when attached because the adhesive is applied to the surface of the substrate, and thereafter the substrate is heated and cooled.


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