The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Apr. 20, 2011
Applicants:

Jeffrey Drue David, San Jose, CA (US);

Harry Q. Lee, Los Altos, CA (US);

Thian Choi Lim, Singapore, SG;

Gary Ka Ho Lam, Santa Clara, CA (US);

Inventors:

Jeffrey Drue David, San Jose, CA (US);

Harry Q. Lee, Los Altos, CA (US);

Thian Choi Lim, Singapore, SG;

Gary Ka Ho Lam, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2011.01); B24B 49/00 (2012.01); G01B 11/28 (2006.01); B24B 49/12 (2006.01); B24B 37/013 (2012.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 49/12 (2013.01);
Abstract

A method of controlling polishing includes polishing a substrate having a second layer overlying a first layer, detecting exposure of the first layer with an in-situ monitoring system, receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a sequence of spectra of light from the substrate while the substrate is being polished, determining a first value for the characteristic of the feature at the time that the first in-situ monitoring technique detects exposure of the first layer, adding an offset to the first value to generate a second value, and monitoring the characteristic of the feature and halting polishing when the characteristic of the feature is determined to reach the second value.


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