The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Dec. 22, 2008
Applicants:

Richard Alfred Beaupre, Pittsfield, MA (US);

Ljubisa Dragoljub Stevanovic, Clifton Park, NY (US);

Daniel Jason Erno, Clifton Park, NY (US);

Charles Gerard Woychik, Niskayuna, NY (US);

Inventors:

Richard Alfred Beaupre, Pittsfield, MA (US);

Ljubisa Dragoljub Stevanovic, Clifton Park, NY (US);

Daniel Jason Erno, Clifton Park, NY (US);

Charles Gerard Woychik, Niskayuna, NY (US);

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02B 1/00 (2006.01); H05K 7/20 (2006.01); H01L 23/34 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 2924/09701 (2013.01);
Abstract

A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar surface. The cooling device also includes a channel layer bonded to an opposite side of the ceramic substrate and a manifold layer bonded to an outer surface of the channel layer. The substrate layers are bonded together using a high temperature process such as brazing to form a single substrate assembly. A plenum housing is bonded to the single substrate assembly via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports.


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