The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Mar. 21, 2013
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Inventors:
Toshio Kobayashi, Nagano, JP;
Hiroshi Shimizu, Nagano, JP;
Toshiyuki Okabe, Nagano, JP;
Yasuyuki Kimura, Nagano, JP;
Kazutaka Kobayashi, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49586 (2013.01); H01L 23/49568 (2013.01); H01L 23/36 (2013.01); H01L 23/49861 (2013.01); H01L 21/4828 (2013.01); H01L 23/49548 (2013.01); H01L 2224/48137 (2013.01); H01L 24/49 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/4911 (2013.01); H01L 2924/18301 (2013.01); H01L 2224/48248 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16238 (2013.01); H01L 25/0655 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to support the leads. A first surface of each lead is exposed from a first surface of the insulating resin layer.