The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Sep. 03, 2010
Applicants:

Chun-fai Cheng, Hsinchu, TW;

Ka-hing Fung, Hsinchu, TW;

Shyh-wei Wang, Hsinchu, TW;

Chin-te Su, Longtan Township, Taoyuan county, TW;

Inventors:

Chun-Fai Cheng, Hsinchu, TW;

Ka-Hing Fung, Hsinchu, TW;

Shyh-Wei Wang, Hsinchu, TW;

Chin-Te Su, Longtan Township, Taoyuan county, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/265 (2006.01); H01L 21/266 (2006.01); H01L 21/285 (2006.01); H01L 21/8238 (2006.01); H01L 29/165 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7848 (2013.01); H01L 21/26586 (2013.01); H01L 21/266 (2013.01); H01L 21/28525 (2013.01); H01L 21/823807 (2013.01); H01L 21/823814 (2013.01); H01L 21/823828 (2013.01); H01L 29/165 (2013.01); H01L 29/66545 (2013.01); H01L 29/66659 (2013.01); H01L 29/7835 (2013.01); H01L 29/6656 (2013.01);
Abstract

The present disclosure provides a semiconductor device and methods of making wherein the semiconductor device has strained asymmetric source and drain regions. A method of fabricating the semiconductor device includes providing a substrate and forming a poly gate stack on the substrate. A dopant is implanted in the substrate at an implant angle ranging from about 10° to about 25° from perpendicular to the substrate. A spacer is formed adjacent the poly gate stack on the substrate. A source region and a drain region are etched in the substrate. A strained source layer and a strained drain layer are respectively deposited into the etched source and drain regions in the substrate, such that the source region and the drain region are asymmetric with respect to the poly gate stack. The poly gate stack is removed from the substrate and a high-k metal gate is formed using a gate-last process where the poly gate stack was removed.


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