The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Oct. 30, 2012
Applicant:
Mediatek Singapore Pte. Ltd., Singapore, SG;
Inventors:
Jieyun Jiang, Shenzhen, CN;
Shih-Chin Lin, Daxi Township, Taoyuan County, TW;
Fu-Kang Pan, New Taipei, TW;
Yang Liu, Shenzhen, CN;
Hung-Chang Hung, Taipei, TW;
Assignee:
MediaTek Singapore Pte. Ltd, Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H05K 1/111 (2013.01); H05K 3/3452 (2013.01); H05K 3/3436 (2013.01); H05K 2201/094 (2013.01);
Abstract
Embodiments of a printed circuit board (PCB) and an electronic apparatus are provided. The PCB includes a PCB substrate and a plurality of the pads. The PCB substrate is disposed with the plurality of the pads. The plurality of the pads include a first type of the pads and a second type of the pads. The first type of the pads adopts the solder mask defined structure, and the second type of the pads adopts the non-solder mask defined structure.