The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Jul. 31, 2012
Applicants:
Toru Furuta, Ogaki, JP;
Fumitaka Takagi, Ogaki, JP;
Inventors:
Toru Furuta, Ogaki, JP;
Fumitaka Takagi, Ogaki, JP;
Assignee:
IBIDEN Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/34 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H05K 1/114 (2013.01); H05K 3/3452 (2013.01); H05K 3/4652 (2013.01); H05K 3/10 (2013.01);
Abstract
A wiring board includes an interlayer insulation layer, conductive patterns formed on the interlayer insulation layer, and a solder-resist layer formed on the interlayer insulation layer and having an opening partially exposing the conductive patterns. The solder-resist layer has an edge portion bordering the opening and intersecting the conductive patterns, and the edge portion of the solder-resist layer has a concavo-convex shape having convex portions and concave portions such that the convex portions and the concave portions are alternately intersecting the conductive patterns.