The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Sep. 29, 2011
Hin Yiu Anthony Chung, Ulm, DE;
Dirk Schaffer, Jena, DE;
Hin Yiu Anthony Chung, Ulm, DE;
Dirk Schaffer, Jena, DE;
Carl Zeiss SMT GmbH, Oberkochen, DE;
Abstract
A method for bonding a first body () to a second, panel-shaped body () at bonding surfaces () lying opposite each other, the second body () projecting in at least one direction (X) beyond an edge (') of the first body (). The method includes: producing a plurality of spacers (to′ to′) on at least one of the bonding surfaces (), applying adhesive () into intermediate spaces (to) between the spacers beyond an outer spacer (′) as far as an adhesive periphery (), which is formed at an edge (′) of the first body (), and bonding the bodies () by bringing the bonding surfaces () into contact at the spacers (′ to′). A prescribed distance (d) between the adhesive periphery () and the outermost spacer () is set to provide a desired state of deformation of the panel-shaped body () after a shrinkage of the applied adhesive () (e.g. minimized bending of the body.) In an associated composite body (), the prescribed distance (d) lies between 20 μm and 250 μm, preferably between 30 μm and 200 μm, in particular between 40 μm and 150 μm.