The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Jul. 30, 2012
Veeraraghavan S. Basker, Schenectady, NY (US);
Eduard Cartier, New York, NY (US);
Hariklia Deligianni, Tenafly, NJ (US);
Rajarao Jammy, Hopewell Junction, NY (US);
Vamsi K. Paruchuri, New York, NY (US);
Veeraraghavan S. Basker, Schenectady, NY (US);
Eduard Cartier, New York, NY (US);
Hariklia Deligianni, Tenafly, NJ (US);
Rajarao Jammy, Hopewell Junction, NY (US);
Vamsi K. Paruchuri, New York, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electroplating apparatus and method for depositing a metallic layer on the surface of a wafer is provided wherein said apparatus and method do not require physical attachment of an electrode to the wafer. The surface of the wafer to be plated is positioned to face the anode and a plating fluid is provided between the wafer and the electrodes to create localized metallic plating. The wafer may be positioned to physically separate and lie between the anode and cathode so that one side of the wafer facing the anode contains a catholyte solution and the other side of the wafer facing the cathode contains an anolyte solution. Alternatively, the anode and cathode may exist on the same side of the wafer in the same plating fluid. In one example, the anode and cathode are separated by a semi permeable membrane.