The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Jan. 17, 2014
Applicant:
Besi Switzerland Ag, Cham, CH;
Inventor:
Andreas Mayr, Wiesing, AT;
Assignee:
Besi Switzerland AG, Cham, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); H01L 21/67 (2006.01); B29C 65/00 (2006.01); B30B 15/06 (2006.01); B30B 15/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); B29C 66/9121 (2013.01); B30B 15/064 (2013.01); B30B 15/34 (2013.01);
Abstract
A bonding head for mounting semiconductor chips on a substrate comprises a bonding head body and a suction member formed of a single piece. The elements necessary for heating, cooling and monitoring the temperature of the suction member are all integrated into the suction member, so that neither the heating nor the cooling elements are separated from the semiconductor chip by a surface preventing the heat transfer. The bonding head body contains only the elements necessary for supplying the suction member with electrical power and with the cooling medium.