The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Apr. 09, 2010
Kota Noda, Ogaki, JP;
Tsutomu Yamauchi, Ogaki, JP;
Kota Noda, Ogaki, JP;
Tsutomu Yamauchi, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A method for manufacturing printed wiring board includes irradiating laser on first surface of substrate such that first opening portion having first opening on the first surface and inner diameter decreasing toward the second surface is formed, irradiating laser on second surface of the substrate such that second opening portion having second opening on the second surface and inner diameter decreasing toward the first surface is formed and that the second portion joins the first portion and forms a penetrating hole penetrating through the substrate, forming a first circuit on the first surface, forming a second circuit on the second surface, and filling the hole with plating such that a through-hole conductor which electrically connects the first and second circuits is formed. The first opening has diameter same as or greater than diameter of the second opening, and the first portion has depth less than depth of the second portion.