The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2014

Filed:

Oct. 01, 2010
Applicants:

Mitsuaki Toda, Ayase, JP;

Yoshio Imamura, Ayase, JP;

Takuya Hasegawa, Ayase, JP;

Inventors:

Mitsuaki Toda, Ayase, JP;

Yoshio Imamura, Ayase, JP;

Takuya Hasegawa, Ayase, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/182 (2013.01); H05K 1/188 (2013.01); H05K 3/32 (2013.01); H05K 2201/10204 (2013.01); H05K 1/0269 (2013.01); H05K 2201/09918 (2013.01);
Abstract

A component-embedded substrate includes an electrically insulating base () of resin, an electric or electronic embedded component () and a dummy embedded component () both embedded in the insulating base (), a conductor pattern () formed on at least one side of the insulating base () and connected directly to or indirectly via a connection layer () to the embedded component () and the dummy embedded component (), and a mark () formed on a surface of the dummy embedded component () and used as a reference when the conductor pattern () is formed, whereby positional accuracy of the conductor pattern () relative to the embedded component () can be improved.


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