The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Aug. 22, 2012
Yuling Liu, Tianjin, CN;
Xiaoyan Liu, Tianjin, CN;
Jun Tian, Tianjin, CN;
Other;
Abstract
A method of polishing copper wiring surfaces of in ultra large scale integrated circuit, the method including: a) preparing a polishing solution including between 35 and 80 w. % of a nano SiOabrasive, between 12 and 60 w. % of deionized water, between 1 and 3 w. % of an oxidant, between 1 and 4 w. % of an active agent, and between 0.5 and 1.5 w. % of a chelating agent; and b) polishing using the polishing solution under following conditions: between 2 and 5 kPa pressure; between 20 and 50° C.; between 120 and 250 mL/min slurry flow rate; and at between 30 and 60 rpm/min rotational speed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile