The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Jul. 18, 2013
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/367 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 24/82 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 23/48 (2013.01); H01L 2225/06531 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06589 (2013.01); H01L 23/3677 (2013.01); H01L 2225/06572 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 24/16 (2013.01); H01L 2225/06517 (2013.01); H01L 23/5227 (2013.01); H01L 2225/06551 (2013.01);
Abstract
A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die.