The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Nov. 16, 2007
Applicants:
John Damiano, Jr., Apex, NC (US);
Stephen E. Mick, Apex, NC (US);
David P. Nackashi, Raleigh, NC (US);
Inventors:
John Damiano, Jr., Apex, NC (US);
Stephen E. Mick, Apex, NC (US);
David P. Nackashi, Raleigh, NC (US);
Assignee:
Protochips, Inc., Raleigh, NC (US);
Primary Examiner:
Int. Cl.
CPC ...
G01N 15/06 (2006.01); G01N 23/04 (2006.01); H01J 37/20 (2006.01); G01N 27/416 (2006.01); B82Y 10/00 (2011.01); B82Y 30/00 (2011.01); G01N 27/30 (2006.01); G01N 27/06 (2006.01); G01N 27/333 (2006.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
G01N 23/046 (2013.01); G01N 27/4167 (2013.01); B82Y 10/00 (2013.01); B82Y 30/00 (2013.01); G01N 27/302 (2013.01); G01N 27/06 (2013.01); G01N 27/3335 (2013.01); B82Y 40/00 (2013.01); H01J 37/20 (2013.01); H01J 2237/26 (2013.01); H01J 2237/28 (2013.01); Y10S 436/805 (2013.01); Y10S 436/809 (2013.01);
Abstract
A sample support structure comprising a sample support manufactured from a semiconductor material and having one or more openings therein. Methods of making and using the sample support structure.