The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Mar. 15, 2012
Yam MO Wong, Singapore, SG;
Ka Shing Kwan, Singapore, SG;
Hing Leung LI, Yuen Long, HK;
Xiang Chao LI, Singapore, SG;
Yam Mo Wong, Singapore, SG;
Ka Shing Kwan, Singapore, SG;
Hing Leung Li, Yuen Long, HK;
Xiang Chao Li, Singapore, SG;
ASM Technology Singapore Pte Ltd, Singapore, SG;
Abstract
Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.