The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2014

Filed:

Oct. 28, 2009
Applicants:

Wolfgang Schrittwieser, Kapfenberg, AT;

Patrick Lenhardt, Spielberg bei Knittelfeld, AT;

Klaus Merl, Bruck a. d. Mur, AT;

Inventors:

Wolfgang Schrittwieser, Kapfenberg, AT;

Patrick Lenhardt, Spielberg bei Knittelfeld, AT;

Klaus Merl, Bruck a. d. Mur, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 3/36 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 23/544 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 21/6835 (2013.01); H01L 23/5389 (2013.01); H01L 23/544 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H05K 1/185 (2013.01); H05K 1/188 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2221/68345 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54473 (2013.01); H01L 2224/2402 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/078 (2013.01); H01L 2924/07802 (2013.01); H05K 3/0035 (2013.01); H05K 3/0038 (2013.01); H05K 3/025 (2013.01); H05K 3/305 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09918 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/0554 (2013.01); H05K 2203/108 (2013.01); H05K 2203/1469 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/014 (2013.01);
Abstract

The invention relates to a method for integrating an electronic component into a printed circuit board, whereby the electronic component () comprising contacts () oriented towards an insulating layer () which is fixed to a laminate consisting of a conductive layer () and a insulating layer (). Once the component () has been fixed to the insulating layer (), at least one hole or perforation () corresponding to the contacts () of the component () are formed in the conducting layer () and in the insulating layer (), the contacts come into contact with the conducting layer (), enabling a reliable integration or embedding of an electronic component () into a printed circuit board.


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