The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2014
Filed:
Aug. 03, 2012
Applicants:
Chih-hsien Chiu, Taichung, TW;
Tsung-hsien Tsai, Taichung, TW;
Chao-ya Yang, Taichung, TW;
Inventors:
Assignee:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/24 (2006.01); H01Q 1/52 (2006.01); H01L 23/552 (2006.01); H01Q 1/36 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 2223/6677 (2013.01); H01Q 1/243 (2013.01); H01Q 1/38 (2013.01); H01L 23/3121 (2013.01); H01Q 1/521 (2013.01); H01L 2224/32225 (2013.01); H01Q 1/52 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/48227 (2013.01); H01Q 1/36 (2013.01); H01L 23/66 (2013.01); H01L 2224/16225 (2013.01);
Abstract
A packaging structure and a method of fabricating the same are provided. The packaging structure includes a substrate, first packaging element disposed on the substrate, a second packaging element disposed on the substrate and spaced apart from the first packaging element, a first antenna disposed on the first packaging element, and a metal layer formed on the second packaging element. The installation of the metal layer and the antenna enhances the electromagnetic shielding effect.