The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2014
Filed:
Jun. 09, 2011
Xinchun LU, Beijing, CN;
Pan Shen, Beijing, CN;
Xinchun Lu, Beijing, CN;
Pan Shen, Beijing, CN;
Tsinghua University, Beijing, CN;
Abstract
A measuring device for measuring a film thickness of a silicon wafer () comprises: position and velocity sensors () linearly arranged along a longitudinal direction into first and second position and velocity sensor arrays spaced apart from each other in a lateral direction, in which the position and velocity sensors () in the first position and velocity sensor array are in one-to-one correspondence with the position and velocity sensors () in the second position and velocity sensor array in the lateral direction; an eddy current sensor () disposed in a symmetrical plane between the first position and velocity sensor array and the second position and velocity sensor array and perpendicular to the lateral direction; and a controller connected to the position and velocity sensors () and the eddy current sensor () respectively for controlling measurement of the thickness of the film according to detection signals from the position and velocity sensors () and the eddy current sensor ().