The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2014
Filed:
Dec. 14, 2010
Yasuhisa Sano, Osaka, JP;
Kazuto Yamauchi, Osaka, JP;
Junji Murata, Osaka, JP;
Takeshi Okamoto, Osaka, JP;
Shun Sadakuni, Osaka, JP;
Keita Yagi, Tokyo, JP;
Yasuhisa Sano, Osaka, JP;
Kazuto Yamauchi, Osaka, JP;
Junji Murata, Osaka, JP;
Takeshi Okamoto, Osaka, JP;
Shun Sadakuni, Osaka, JP;
Keita Yagi, Tokyo, JP;
Osaka University, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A polishing method and a polishing apparatus finish a surface of a substrate of a compound semiconductor containing an element such as Ga or the like to a desired level of flatness, so that the surface can be flattened with high surface accuracy within a practical processing time. In the presence of water, such as weak acid water, water with air dissolved therein, or electrolytic ion water, the surface of the substrate made of a compound semiconductor containing either one of Ga, Al, and In and a surface of a polishing pad having an electrically conductive member in an area of the surface which is held in contact with the substrate) are relatively moved while being held in contact with each other, thereby polishing the surface of the substrate.