The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2014

Filed:

Sep. 21, 2009
Applicants:

Chun-an LU, Xinzhuang, TW;

Hong-ching Lin, Kaohsiung, TW;

Kuo-chan Chiou, Tainan, TW;

Szu-po Huang, Taipei, TW;

Inventors:

Chun-An Lu, Xinzhuang, TW;

Hong-Ching Lin, Kaohsiung, TW;

Kuo-Chan Chiou, Tainan, TW;

Szu-Po Huang, Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); B22F 9/30 (2006.01); B22F 1/02 (2006.01); C01G 1/02 (2006.01); C09D 11/52 (2014.01);
U.S. Cl.
CPC ...
B22F 9/30 (2013.01); B22F 1/025 (2013.01); C01G 1/02 (2013.01); C09D 11/52 (2013.01); B22F 2998/00 (2013.01); C01P 2002/72 (2013.01); C01P 2006/40 (2013.01);
Abstract

A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials.


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