The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2014
Filed:
May. 24, 2010
Applicants:
Michael S. Randall, Simpsonville, SC (US);
Chris Wayne, Moore, SC (US);
John Mcconnell, Pelzer, SC (US);
Inventors:
Michael S. Randall, Simpsonville, SC (US);
Chris Wayne, Moore, SC (US);
John McConnell, Pelzer, SC (US);
Assignee:
Kemet Electronics Corporation, Simpsonville, SC (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 7/00 (2006.01); H01G 4/40 (2006.01); H05K 1/14 (2006.01); H05K 3/46 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/141 (2013.01); H05K 3/4629 (2013.01); H01G 4/40 (2013.01); H05K 3/4611 (2013.01); H01G 4/30 (2013.01); H01G 4/12 (2013.01); H05K 2201/09018 (2013.01); H05K 1/147 (2013.01); H05K 1/0306 (2013.01);
Abstract
A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.