The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Feb. 08, 2011
Takayuki Teshima, Yokohama, JP;
Shinan Wang, Kashiwa, JP;
Yutaka Setomoto, Tokyo, JP;
Takashi Nakamura, Yokohama, JP;
Takayuki Teshima, Yokohama, JP;
Shinan Wang, Kashiwa, JP;
Yutaka Setomoto, Tokyo, JP;
Takashi Nakamura, Yokohama, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A microstructure manufacturing method includes: preparing a mold having on a front side thereof a plurality of fine structures, with conductivity being imparted to a bottom portion between the plurality of fine structures; forming a first plating layer between the plurality of fine structures by plating the bottom portion; and forming a second plating layer of larger stress than the first plating layer on the first plating layer between the plurality of fine structures, wherein the stress of the second plating layer is used to curve a back side surface of the mold.