The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Jan. 29, 2009
Applicants:
Kazuhiro Iriguchi, Nagasaki, JP;
Toshiyuki Isami, Kanagawa, JP;
Kouhei Kawano, Kanagawa, JP;
Inventors:
Assignee:
Sumco Techxiv Corporation, Nagasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01);
Abstract
A method for evaluating a shape change of a semiconductor wafer is provided. The method comprises acquiring unconstrained shape data of shape data of the semiconductor wafer being placed on a reference surface in a unconstrained state; acquiring constrained shape data of shape data of the semiconductor wafer being constrained along the reference surface in a constrained state; and comparing the unconstrained shape data and the constrained shape data. A method for manufacturing the semiconductor wafer utilizing a result of the evaluation of the wafer is also provided.