The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Sep. 22, 2011
Applicants:
Daniel Bensahel, Grenoble, FR;
Aomar Halimaoui, La Terrasse, FR;
Inventors:
Daniel Bensahel, Grenoble, FR;
Aomar Halimaoui, La Terrasse, FR;
Assignee:
STMicroelectronics (Crolles 2) SAS, Crolles, FR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 29/78 (2006.01); H01L 21/18 (2006.01); H01L 21/3063 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78 (2013.01); H01L 21/187 (2013.01); H01L 21/3063 (2013.01); H01L 29/7849 (2013.01);
Abstract
A method for forming an electronic circuit on a strained semiconductor substrate, including the steps of: forming, on a first surface of a semiconductor substrate, electronic components defining electronic chips to be sawn; and forming at least portions of a layer of a porous semiconductor material on the side of a second surface of the semiconductor substrate, opposite to the first surface, to bend the semiconductor substrate.