The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
May. 09, 2014
Applicants:
Paul C. Lindsey, Jr., Lafayette, CA (US);
Darrell Foote, Walnut Creek, CA (US);
Inventors:
Paul C. Lindsey, Jr., Lafayette, CA (US);
Darrell Foote, Walnut Creek, CA (US);
Assignee:
Micro Processing Technology, Inc., Lafayette, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01);
Abstract
A method of dividing a semiconductor wafer in which a sheet of deformable material engaging the metal layer side of the wafer has pressurized fluid applied thereto to cause the metal layer to break at the locations of wafer scribe streets.
Lindsey, Jr., Paul. (2014). Method using fluid pressure to remove back metal from semiconductor wafer scribe streets (U.S. Patent No. 8906745). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8906745
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile