The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2014

Filed:

Nov. 09, 2012
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd, Hsin-Chu, TW;

Inventors:

Greja Johanna Adriana Maria Verheijden, Riethoven, NL;

Roel Daamen, Herkenbosch, NL;

Gerhard Koops, Aaist, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 3/00 (2006.01); H01L 29/84 (2006.01); H01L 21/311 (2006.01); H01L 21/50 (2006.01); H01L 21/02 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/84 (2013.01); H01L 21/31116 (2013.01); H01L 21/50 (2013.01); H01L 21/02 (2013.01); B81C 1/00476 (2013.01); H01L 21/02126 (2013.01);
Abstract

The invention relates to a micro-device with a cavity, the micro-device comprising a substrate, the method comprising steps of: A) providing the substrate, having a surface and comprising a sacrificial oxide region at the surface; B) covering the sacrificial oxide region with a porous layer being permeable to a vapor HF etchant, and C) selectively etching the sacrificial oxide region through the porous layer using the vapor HF etchant to obtain the cavity. This method may be used in the manufacture of various micro-devices with a cavity, i.e. MEMS devices, and in particular in the encapsulation part thereof, and semiconductor devices, and in particular the BEOL-part thereof.


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