The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2014

Filed:

Jul. 16, 2012
Applicants:

David Thompson, San Jose, CA (US);

Jeffrey W. Anthis, San Jose, CA (US);

Christian Dussarrat, Newark, DE (US);

Clement Lansalot-matras, Seoul, KR;

Inventors:

David Thompson, San Jose, CA (US);

Jeffrey W. Anthis, San Jose, CA (US);

Christian Dussarrat, Newark, DE (US);

Clement Lansalot-Matras, Seoul, KR;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/18 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
C23C 16/18 (2013.01); C23C 16/45553 (2013.01);
Abstract

Methods for deposition of metal films consisting essentially of Co, Mn, Ru or a lanthanide on surfaces using metal coordination complexes are provided. The precursors used in the process include a 2-methylimine pyrrolyl ligand and/or N,N'-diisopropylformamidinato ligand. The precursors may also contain cyclopentadienyl, pentamethylcyclopentadienyl or pyrrolyl groups.


Find Patent Forward Citations

Thompson, David. (2014). Method of atomic layer deposition using metal precursors (U.S. Patent No. 8906457). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8906457

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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