The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

May. 24, 2011
Applicants:

John E. Mcconnell, Pelzer, SC (US);

John Bultitude, Greenville, SC (US);

Reggie Phillips, Fountain Inn, SC (US);

Robert Allen Hill, Simpsonville, SC (US);

Garry L. Renner, Easley, SC (US);

Philip M. Lessner, Newberry, SC (US);

Antony P. Chacko, Greer, SC (US);

Jeffrey Bell, Fountain Inn, SC (US);

Keith Brown, Simpsonville, SC (US);

Inventors:

John E. McConnell, Pelzer, SC (US);

John Bultitude, Greenville, SC (US);

Reggie Phillips, Fountain Inn, SC (US);

Robert Allen Hill, Simpsonville, SC (US);

Garry L. Renner, Easley, SC (US);

Philip M. Lessner, Newberry, SC (US);

Antony P. Chacko, Greer, SC (US);

Jeffrey Bell, Fountain Inn, SC (US);

Keith Brown, Simpsonville, SC (US);

Assignee:

Kemet Electronics Corporation, Simpsonville, SC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H01G 4/06 (2006.01); H01G 4/30 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 35/36 (2006.01); H01G 4/232 (2006.01); B23K 1/008 (2006.01); B23K 35/02 (2006.01); H01G 4/005 (2006.01); B23K 1/005 (2006.01);
U.S. Cl.
CPC ...
H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01L 2924/01322 (2013.01); B23K 1/0016 (2013.01); H01L 2224/83825 (2013.01); B23K 1/203 (2013.01); B23K 35/3613 (2013.01); B23K 1/008 (2013.01); B23K 35/0227 (2013.01); H01L 2924/01327 (2013.01); H01G 4/005 (2013.01); B23K 1/0053 (2013.01); B23K 2201/42 (2013.01); H01L 2924/10253 (2013.01);
Abstract

A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.


Find Patent Forward Citations

Loading…