The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Mar. 16, 2011
Applicants:

Byoung-rim Seo, Hwaseong-si, KR;

Beoung-ouk Min, Yongin-si, KR;

Tae-je Cho, Yongin-si, KR;

Yung-cheol Kong, Cheonan-si, KR;

Dong-min Kim, Suwon-si, KR;

Ji-woong Park, Suwon-si, KR;

Inventors:

Byoung-Rim Seo, Hwaseong-si, KR;

Beoung-Ouk Min, Yongin-si, KR;

Tae-Je Cho, Yongin-si, KR;

Yung-Cheol Kong, Cheonan-si, KR;

Dong-Min Kim, Suwon-si, KR;

Ji-Woong Park, Suwon-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01);
Abstract

An image sensor module includes a circuit board, an image sensor package and an optical system. The circuit board has an upper surface and a lower surface, the substrate having a window. The image sensor package includes a mounting substrate and an image sensor chip mounted on the mounting substrate, the image sensor package being adhered to the lower surface of the circuit board such that the image sensor chip is exposed through the window. The optical system is provided on the upper surface of the circuit board to guide light from an object to the image sensor chip.


Find Patent Forward Citations

Loading…