The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Mar. 31, 2011
Applicant:
Osamu Yamagata, Kanagawa, JP;
Inventor:
Osamu Yamagata, Kanagawa, JP;
Assignee:
J-Devices Corporation, Usuki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/12 (2013.01); H01L 24/97 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/014 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/73267 (2013.01);
Abstract
A semiconductor device comprises a semiconductor chip having a plurality of electrode pads; an insulation layer having one or more apertures which expose at least a part of the plurality of electrode pads respectively on the semiconductor chip; and a plurality of wires which are electrically connected to the exposed plurality of electrode pads.