The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Dec. 05, 2012
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/488 (2006.01); H01L 29/84 (2006.01); H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/488 (2013.01); H01L 29/84 (2013.01); H01L 21/56 (2013.01); H01L 21/67242 (2013.01); H01L 23/48 (2013.01);
Abstract
An embedded chip package is provided. The embedded chip package includes a plurality of chips; encapsulation material embedding the plurality of chips; at least one electrical redistribution layer electrically connected to the plurality of chips; and a common terminal connected to the at least one electrical redistribution layer, wherein the common terminal provides an interface to at least one of transmit and receive a common electrical signal between the plurality of chips and the common terminal.