The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Mar. 15, 2011
Applicants:

Akihiko Tateiwa, Nagano, JP;

Masahiro Kyozuka, Nagano, JP;

Fumimasa Katagiri, Tempe, AZ (US);

Inventors:

Akihiko Tateiwa, Nagano, JP;

Masahiro Kyozuka, Nagano, JP;

Fumimasa Katagiri, Tempe, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H05K 3/46 (2006.01); H01L 29/40 (2006.01); H05K 3/34 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/81192 (2013.01); H05K 3/3436 (2013.01); H01L 2224/04105 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01011 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/15311 (2013.01); H01L 21/6835 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01013 (2013.01); H01L 24/19 (2013.01); H01L 2224/83102 (2013.01); H01L 2924/09701 (2013.01); H01L 21/563 (2013.01); H01L 2224/92125 (2013.01); H05K 3/4682 (2013.01); H05K 2201/09136 (2013.01); H01L 2924/01046 (2013.01); H01L 2224/211 (2013.01); H01L 2224/20 (2013.01); H01L 1/0271 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01024 (2013.01); H01L 2224/81801 (2013.01);
Abstract

A wiring board has a structure where multiple wiring layers are stacked one on top of another with insulating layers interposed therebetween. A sheet-shaped member is buried in an outermost insulating layer located on a side of the structure opposite to a side on which a semiconductor element is to be mounted. The sheet-shaped member has a modulus of elasticity and a coefficient of thermal expansion which are similar to a modulus of elasticity and a coefficient of thermal expansion of the semiconductor element. The sheet-shaped member is made of a material having a modulus of elasticity and a coefficient of thermal expansion which are enough to bring respective distributions thereof into a substantially symmetric form in a direction orthogonal to a surface of the wiring board in the case where the semiconductor element is mounted.


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