The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Feb. 16, 2012
Cheng-chung Lin, Taipei, TW;
Kuei-wei Huang, Hsin-Chu, TW;
Ai-tee Ang, Hsin-Chu, TW;
Tsai-tsung Tsai, Taoyuan, TW;
Ming-da Cheng, Jhubei, TW;
Chung-shi Liu, Hsin-Chu, TW;
Cheng-Chung Lin, Taipei, TW;
Kuei-Wei Huang, Hsin-Chu, TW;
Ai-Tee Ang, Hsin-Chu, TW;
Tsai-Tsung Tsai, Taoyuan, TW;
Ming-Da Cheng, Jhubei, TW;
Chung-Shi Liu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method includes laminating a Non-Conductive Film (NCF) over a first package component, and bonding a second package component on the first package component. The NCF and the second package component are on a same side of the first package component. Pillars of a mold tool are then forced into the NCF to form openings in the NCF. The connectors of the first package component are exposed through the openings.