The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
May. 28, 2013
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Alex R. Hubbard, East Greenbush, NY (US);
Douglas C. La Tulipe, Jr., Guilderland, NY (US);
Spyridon Skordas, Troy, NY (US);
Kevin R. Winstel, East Greenbush, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); H01L 21/30 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 24/80 (2013.01);
Abstract
A method for wafer bonding includes measuring grid distortion for a mated pairing of wafers to be bonded to determine if misalignment exists between the wafers. During processing of subsequent wafers, magnification of one or more lithographic patterns is adjusted to account for the misalignment. The subsequent wafers are bonded with reduced misalignment.