The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Jul. 23, 2009
Applicants:
Hisataka Minami, Hitachi, JP;
Ryouta Saisyo, Hitachi, JP;
Hiroshi Ono, Hitachi, JP;
Inventors:
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03C 15/00 (2006.01); C03C 25/68 (2006.01); H01L 21/302 (2006.01); H01L 21/461 (2006.01); C09K 3/14 (2006.01); B24B 37/04 (2012.01); C09G 1/02 (2006.01); H01L 21/321 (2006.01); H01L 23/00 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
C09K 3/1463 (2013.01); B24B 37/044 (2013.01); C09G 1/02 (2013.01); H01L 21/3212 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 29/0657 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/03616 (2013.01); H01L 2224/05026 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/051 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/94 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01038 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01056 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/014 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/14 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01037 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01044 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01055 (2013.01); H01L 2924/01074 (2013.01);
Abstract
The CMP polishing liquid of the present invention contains 1,2,4-triazole, a phosphoric acid, an oxidant, and abrasive particles. The polishing method of the present invention is a substrate polishing method for polishing a substrate with a polishing cloth while supplying a CMP polishing liquid between the substrate and the polishing cloth, in which the substrate is a substrate having a palladium layer, and the CMP polishing liquid is a CMP polishing liquid containing 1,2,4-triazole, a phosphoric acid, an oxidant, and abrasive particles.