The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Jun. 21, 2010
Applicants:

Naoki Noda, Kawasaki, JP;

Mitsuru Koarai, Minami-Alps, JP;

Toshio Yokouchi, Nirasaki, JP;

Masahiro Ishimori, Kopu, JP;

Inventors:

Naoki Noda, Kawasaki, JP;

Mitsuru Koarai, Minami-Alps, JP;

Toshio Yokouchi, Nirasaki, JP;

Masahiro Ishimori, Kopu, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/30 (2006.01); H01L 23/538 (2006.01); B81C 1/00 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); B81C 1/00238 (2013.01); H01L 21/02 (2013.01); B81C 2203/035 (2013.01); B81B 2207/012 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An electronic devicehas a first semiconductor substrateon which a bonding projection sectionis projected via an insulation film, a second semiconductor substratethat is bonded by welding the bonding projection sectionof the first semiconductor substratevia conductive bonding material, a through holethat is formed to penetrate the bonding projection sectionand the insulation filmin a bonding direction, and a conduction wiring sectionthat is formed by the conductive bonding material filled in the through holeat a time of bonding by welding and conducts the first semiconductor substratewith the second semiconductor substrateto have same electric potential.


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