The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Jun. 06, 2011
Applicant:

Masahiro Sunohara, Grenoble, FR;

Inventor:

Masahiro Sunohara, Grenoble, FR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4605 (2013.01); H05K 3/4661 (2013.01); H05K 3/388 (2013.01); H05K 2203/308 (2013.01);
Abstract

A wiring substrate includes a wiring layer made of copper, an electrode layer made of copper, and an insulating layer arranged adjacent to the electrode layer. The wiring layer is stacked on the electrode layer and the insulating layer. The insulating layer and the wiring layer are stacked with an adhesive layer interposed between the wiring insulating layer and the wiring layer. The electrode layer and the wiring layer are stacked without the adhesive layer interposed between the electrode layer and the wiring layer.


Find Patent Forward Citations

Sunohara, Masahiro. (2014). Wiring substrate (U.S. Patent No. 8895868). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8895868

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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