The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Dec. 19, 2012
Applicant:
SK Hynix Inc., Gyeonggi-do, KR;
Inventors:
Tae-Yoon Kim, Gyeonggi-do, KR;
Heung-Jae Cho, Gyeonggi-do, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02697 (2013.01);
Abstract
A method for fabricating a semiconductor device including a semiconductor substrate having a trench formed therein. A migration assist layer is formed in the trench and on the substrate. A buried layer in formed in the trench by migrating material from the migration assist layer and the semiconductor substrate.