The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Oct. 24, 2012
Applicants:

Semiconductor Manufacturing International Corporation, Shanghai, CN;

Semiconductor Manufacturing International Corporation, Beijing, CN;

Inventors:

Jerry Liu, Shanghai, CN;

Wanchun Ding, Shanghai, CN;

Wendy Wei, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 23/481 (2013.01);
Abstract

A semiconductor device may include a first line of vias including a first via and a second via immediately adjacent to the first via. The semiconductor device may further include a second line of vias arranged immediately adjacent to and parallel to the first line of vias, the second line of vias including a third via immediately adjacent to the first via and the second via, the second line of vias further including a fourth via immediately adjacent to the third via, the first via, and the second via. The shortest distance between the second via and the fourth via may be greater than the shortest distance between the first via and the second via.


Find Patent Forward Citations

Loading…