The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Dec. 29, 2011
Yundong Meng, Guangdong, CN;
Kehong Fang, Guangdong, CN;
Yundong Meng, Guangdong, CN;
Kehong Fang, Guangdong, CN;
Shengyi Technology Co., Ltd., Guangdong, CN;
Abstract
Disclosed is a method for preparing a phosphorus-containing polyphenylene oxide resin with a low molecular weight, comprising the steps of: step 1: providing a phosphorus-containing phenolic compound and a raw polyphenylene oxide resin having a number-average molecular weight of more than 10000; step 2: dissolving the raw polyphenylene oxide resin into a solvent to make a solution of the raw polyphenylene oxide resin; step 3: adding the phosphorus-containing phenolic compound into the solution of the raw polyphenylene oxide resin; step 4: introducing an initiator, and carrying out a re-dispersing reaction at a reaction temperature of above 60° C. under the effect of the initiator; and step 5: after the reaction is finished, the product obtained being phosphorus-containing polyphenylene oxide resin with a low molecular weight, the number-average molecular weight thereof being 1000-6000. By dispersing the phosphorus-containing phenolic compound into the solution of polyphenylene oxide resin, and carrying out the re-dispersing reaction in the presence of the initiator to prepare the phosphorus-containing polyphenylene oxide resin with a low molecular weight, the obtained phosphorus-containing polyphenylene oxide resin with a low molecular weight is convenient to process, and suitable for use as the matrix resin of composite materials for high-frequency circuit boards or as an additive component for other polymeric materials.