The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

May. 18, 2011
Applicants:

Seiji Nishikawa, Tokyo, JP;

Hidetaka Kafuku, Tokyo, JP;

Tadashi Shimazu, Tokyo, JP;

Inventors:

Seiji Nishikawa, Tokyo, JP;

Hidetaka Kafuku, Tokyo, JP;

Tadashi Shimazu, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/469 (2006.01); C23C 16/505 (2006.01); H01L 21/67 (2006.01); C23C 16/34 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02521 (2013.01); C23C 16/505 (2013.01); H01L 21/67017 (2013.01); C23C 16/345 (2013.01); H01J 37/32706 (2013.01); H01L 21/02211 (2013.01); H01J 37/32449 (2013.01); H01L 21/0217 (2013.01); H01L 21/02274 (2013.01); H01L 21/0228 (2013.01);
Abstract

Disclosed are: a method for producing a silicon nitride film, wherein generation of blisters at the periphery of a substrate is suppressed when a silicon nitride film is formed through application of a bias power; and an apparatus for producing a silicon nitride film. Specifically disclosed are a method and apparatus for producing a silicon nitride film, wherein a silicon nitride film used for a semiconductor element is formed on a substrate by plasma processing. In the method and apparatus for producing a silicon nitride film, a bias is applied to the substrate at time (b), and a starting material gas SiHfor the silicon nitride film is started to be supplied at time (b) after the application of the bias.


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