The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Aug. 31, 2012
Chih-chao Yang, Glenmont, NY (US);
Lynne M. Gignac, Beacon, NY (US);
Chao-kun HU, Somers, NY (US);
Surbhi Mittal, West Orange, NJ (US);
Chih-Chao Yang, Glenmont, NY (US);
Lynne M. Gignac, Beacon, NY (US);
Chao-Kun Hu, Somers, NY (US);
Surbhi Mittal, West Orange, NJ (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of fabricating an interconnect structure is provided which includes providing a dielectric material having a dielectric constant of about 3.0 or less and at least one conductive material embedded therein, the at least one conductive material has an upper surface that is coplanar with an upper surface of the dielectric material; and forming a noble metal-containing cap directly on the upper surface of the at least one conductive material, wherein the noble metal cap is discontinuous or non-uniform.