The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Nov. 27, 2007
Applicants:
Yasushi Taniguchi, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Takashi Kitae, Osaka, JP;
Seiji Karashima, Osaka, JP;
Kenichi Hotehama, Osaka, JP;
Inventors:
Yasushi Taniguchi, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Takashi Kitae, Osaka, JP;
Seiji Karashima, Osaka, JP;
Kenichi Hotehama, Osaka, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H05K 3/00 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01); H05K 3/24 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/12 (2013.01); H01L 2924/01056 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01075 (2013.01); H05K 2203/083 (2013.01); H01L 2924/01004 (2013.01); H01L 2224/133 (2013.01); H01L 2924/01002 (2013.01); H01L 2224/0401 (2013.01); H05K 2203/043 (2013.01); H05K 3/3484 (2013.01); H01L 2924/01014 (2013.01); H01L 2224/1308 (2013.01); H01L 24/05 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/14 (2013.01); H01L 2924/01051 (2013.01); H01L 2224/13171 (2013.01); H05K 2201/0338 (2013.01); H01L 2224/13124 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01011 (2013.01); H01L 2224/13144 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01099 (2013.01); H01L 2924/00013 (2013.01); H05K 2203/087 (2013.01); H01L 2224/131 (2013.01); H05K 3/3489 (2013.01); H01L 2924/01082 (2013.01); H01L 24/742 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/16 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01022 (2013.01); H05K 3/244 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13164 (2013.01); H01L 24/02 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/11003 (2013.01); H01L 2924/01005 (2013.01); H01L 2224/13155 (2013.01); H01L 2924/01019 (2013.01); H01L 2224/0558 (2013.01); H01L 21/6835 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01024 (2013.01); H01L 24/11 (2013.01); H01L 2924/01006 (2013.01); H05K 2203/0425 (2013.01); H01L 2224/1329 (2013.01); H01L 2924/0105 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13084 (2013.01);
Abstract
An electrode structureon which a solder bump is placed includes an electrode patternmade of an electrode-constituting material selected from the group consisting of Cu, Al, Cr, and Ti, a Ni layerformed on a part of the electrode pattern, a Pd layerformed on at least a part of a region other than the part of the electrode pattern, and an Au layerformed on the Ni layerand the Pd layer