The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Apr. 18, 2012
Takuya Kadoguchi, Toyota, JP;
Shingo Iwasaki, Toyota, JP;
Takanori Kawashima, Anjo, JP;
Tomomi Okumura, Toyota, JP;
Masayoshi Nishihata, Chiryu, JP;
Takuya Kadoguchi, Toyota, JP;
Shingo Iwasaki, Toyota, JP;
Takanori Kawashima, Anjo, JP;
Tomomi Okumura, Toyota, JP;
Masayoshi Nishihata, Chiryu, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-Shi, JP;
Denso Corporation, Kariya, JP;
Abstract
A semiconductor device includes a first semiconductor element; a first thick plate portion that is electrically connected to an electrode on a lower surface side of the first semiconductor element, and is formed by a conductor; a second semiconductor element that is arranged such that a main surface of the second semiconductor element faces a main surface of the first semiconductor element; a second thick plate portion that is electrically connected to an electrode on a lower surface side of the second semiconductor element, and is formed by a conductor; a third thick plate portion that is electrically connected to an electrode on an upper surface side of the first semiconductor element, and is formed by a conductor; a fourth thick plate portion that is electrically connected to an electrode on an upper surface side of the second semiconductor element, and is formed by a conductor; a first thin plate portion that is provided on the second thick plate portion, is formed by a conductor, and is thinner than the second thick plate portion; and a second thin plate portion that is provided on the third thick plate portion, is formed by a conductor, and is thinner than the third thick plate portion. The first thin plate portion and the second thin plate portion are fixed together and electrically connected.