The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Sep. 21, 2010
Yoshiaki Sugizaki, Kanagawa-ken, JP;
Hideki Shibata, Kanagawa-ken, JP;
Akihiro Kojima, Kanagawa-ken, JP;
Masayuki Ishikawa, Kanagawa-ken, JP;
Hideo Tamura, Kanagawa-ken, JP;
Tetsuro Komatsu, Fukuoka-ken, JP;
Yoshiaki Sugizaki, Kanagawa-ken, JP;
Hideki Shibata, Kanagawa-ken, JP;
Akihiro Kojima, Kanagawa-ken, JP;
Masayuki Ishikawa, Kanagawa-ken, JP;
Hideo Tamura, Kanagawa-ken, JP;
Tetsuro Komatsu, Fukuoka-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, a semiconductor light emitting device includes a light emitting chip and a fluorescent material layer. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, and a resin layer. The semiconductor layer includes a light emitting layer, a first major surface, and a second major surface formed on a side opposite to the first major surface. The fluorescent material layer is provided on the first major surface and has a larger planer size than the light emitting chip.