The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2014

Filed:

Aug. 12, 2013
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Houng Sik Yoo, Seoul, KR;

Jin Young Ryu, Daejeon, KR;

Woo Sung Kim, Daejeon, KR;

Han Na Lee, Daejeon, KR;

Eun Joo Choi, Daejeon, KR;

Hyeon Choi, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 27/10 (2006.01); C08L 43/00 (2006.01); C08L 101/02 (2006.01); C08J 5/00 (2006.01); C08L 35/04 (2006.01); C08L 25/04 (2006.01); C08L 33/04 (2006.01);
U.S. Cl.
CPC ...
C08L 35/04 (2013.01); C08L 101/02 (2013.01); C08J 5/00 (2013.01); C08L 25/04 (2013.01); C08L 33/04 (2013.01);
Abstract

Provided is a resin blend including a first resin and a second resin, the second resin having a hydrophobic functional group in a side chain and having a surface energy difference of 0.1 to 20 mN/m from the first resin at 25° C., the resin blend being capable of forming a layer separation structure. Also, provided are a pellet, a method for preparing the same, and a resin molding article having a specific layer separation structure. The resin blend may not only improve mechanical properties and surface hardness of the molding article but also shorten process time, increase productivity and reduce production cost by omitting an additional surface coating step.


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