The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Oct. 12, 2012
Applicant:
Fujitsu Semiconductor Limited, Yokohama, JP;
Inventor:
Tamotsu Owada, Yokohama, JP;
Assignee:
Fujitsu Semiconductor Limited, Yokohama, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/46 (2006.01);
U.S. Cl.
CPC ...
Abstract
A disclosed method of manufacturing a semiconductor device includes forming a groove on a first surface of a semiconductor wafer along an outer periphery of the semiconductor wafer, forming a semiconductor device on the first surface, forming an adhesive layer on the first surface to cover the semiconductor device, bonding a support substrate to the first surface by the adhesive layer, grinding after the adhering of the support substrate a second surface of the semiconductor wafer opposite to the first surface, and dicing after the grinding the semiconductor wafer into individual semiconductor chips.